PCB Heat Lamination Buffer Pad

Chimiro cheSanpu Silicone Sponge Pad:

1.High Temperature Resistance & Thermal Stability Properties: Haisi-hupfu uye haina kuomeswa mushure mekudzokororwa kwepamusoro-temperature lamination

2.Kusvibiswa Kwakaderera & Kushamwaridzana Nezvakatipoteredza:Pfuura RoHS uye FDA

  3.Closed-Cell Structure:During the lamination process, water vapor released by the boards will not be absorbed and can be discharged smoothly, reducing defects such as bubbles, white spots and delamination.

4.Chemical kugadzikana: Hazviiti ne epoxy resin kana PP prepreg resin uye haizoparadzi foil yemhangura.

Kubatsira kweSilicone Sponge SePCB kupisa lamination buffer pad

1. Yakanakisa kusimba kwemuviri kutsiva mhangura ukobvu musiyano uye bhodhi kusaenzana
2. Uniform pressure distribution, shoma delamination, void, copper indentation defects
3. High tembiricha kuramba uye kugadzikana thermal kushanda
4. Yakavharwa{{0}sero chimiro kuitira kuti unyoro upere
5. Yakaderera sarufa & yakaderera volatiles, yakaderera kusvibiswa, yakachena kugadzirwa
6. Inogona kushandiswazve, kubvaruka-inodzivirirwa, inopindirana neHDI, copper inorema, step PCB

Sarudza Sanpu Silicone

1. Isu tiri yepakutanga silicone siponji mutengesi

2.Tine makore anopfuura 16 ruzivo rwekugadzirwa kwesilicone sponge

3.Kuongororwa kunofanirwa kusati kwabuda mufekitari, mushumo wekuongorora wemhando yakasungirirwa

4.Free samples, taura nesu kuti tiwane sampuli yemahara