Silicone foam board inogona kuwana yunifomu yekupisa kupisa kwete kuburikidza nechinhu chimwe chete, asi semhedzisiro yekubatanidzwa kwemaitiro avo enyama, microstructure uye macroscopic dhizaini. Isu tinogona kuinzwisisa seyakabudirira "kugovera kupisa uye kutamisa system".
Aya anotevera ndiwo mana akakosha maitiro aanoita nawo yunifomu yekupisa conduction:
1. Hwaro hwezvinhu: Iyo inherent kupisa conduction nzira yesilicone rubber pachayo
Basic thermal conductivity:
Chekutanga, iyo silicone rabha inoshandiswa kugadzira furo mapuranga haisi insulator pachayo. Panguva yekugadzirwa, ma thermal conductive fillers akadai sealumina, boron nitride kana zinc oxide anofanopinzwa-akasanganiswa mukati. Aya madiki kana nano{3}}akakura zvidimbu zvinoumba "thermal chain" yakakosha musilicone rubber matrix, kutanga mugwagwa mukuru wekutamisa kupisa.
Thermal kugadzikana:
Silicone inogona kuchengetedza kushanda kwakagadzikana mukati mehupamhi hwekushisa kwe -60 dhigirii kusvika 200 dhigirii, izvo zvinoreva kuti nzira yekupisa yekupisa haizokundikani nekuda kwekushanduka kwekushisa.
2. Core Mystery: Controllable Cell Structure - Kugadzira "heat flow Network"
Uyu ndiwo mutsauko wakanyanya kukosha mune yekupisa conduction meshini pakati pefoam board uye yakasimba mabhodhi.
Homogeneous distribution:
Mabhodhi{{0}emhando yepamusoro silikoni foam board anoratidza zvakanaka, mayunifomu uye akavharika-masero emasero. Aya ma pores haana kurongeka asi akagovaniswa zvakaenzana mukati memukati mezvinhu semuzinga.
Kugadzira matatu-dimensional thermal conductive network:
Fungidzira kuti kupisa kubva kune yakasimba thermal conductive silicone pad inoitiswa pamwe nendege yakasimba. Mumapuranga efoam, madziro emasero anova nzira itsva dzekupisa kupisa. Kupisa kunogona kufambiswa panguva imwe chete ichitevedza madziro egomba aya akabatana mumativi matatu ehurefu, upamhi uye ukobvu hwechinhu, kuita matatu-dimensional uye networked heat distribution system. Izvi zvakafanana nekusimudzira nhevedzano ye-log Bridges kuti ive network inochinjika yemaBridges akakwirira, zvichiita kuti kupisa kupararire nekukasira uye zvakaenzana.
3. Interface kiyi: Kupfava kwakanaka uye kusimba - kuwana "zero gap" kubata
Iri inhanho yakakosha kuve nechokwadi chekuti kupisa kunogona kunyatsopinda mufoam board kubva kune inopisa sosi.
Kuzadza voids:
Kunyange nzvimbo yakatsetseka inoratidzika kuva isina kuenzana pamwero wemicroscopic. Kana zvinhu zvacho zvakaoma, pachava nehuwandu hwemhepo yemhepo pakati payo uye nzvimbo yekupisa uye kupisa kwepasi. Mhepo ine murombo conductor wekupisa, iyo inoumba yakakura "contact thermal resistance".
Deredza kubata kupisa kuramba:
Silicone foam mabhodhi akanyanya kupfava uye anogona kuita yakakosha compression deformation pasi pekumanikidzwa kudiki. Inogona kuzadza aya mamicro-kusaenzana uye macro{2}}kushivirira kweassembly zvakakwana seruoko rwakapfava, kusvina kunze mweya wabatwa. Nenzira iyi, kupisa kunogona kupinda mu "heat conduction network" yefoam board pasina chipingamupinyi kubva pamusoro penzvimbo yekupisa, uye yozoendeswa kune iyo inopisa nzvimbo kubva kune network.
4. Zvose Mhedzisiro: Iyo "Equalizer" yeKupisa
Kubatanidza mapoinzi matatu ari pamusoro, iyo silicone foam board yakafanana ne "heat buffer pool" kana "equalizer":
1.Kutora zvakanaka:
Kupisa kunokurumidza "kunyudzwa" mubhodhi refoam kubva panzvimbo inopisa (senge waya yekupokana) kuburikidza neiyo interface ine yakaderera kubata kupisa kwekudzivirira.
2.Three-dimensional diffusion:
Kana kupisa kwapinda, kunokasira kupararira kumativi ese kuburikidza nenhatu-dimensional cell network yakagoverwa mukati.
3.Uniform kuburitswa:
Pakupedzisira, kupisa kunoshandurwa kubva pa "point" kana "mutsara" kupisa sosi kuita yunifomu "pamusoro" kupisa sosi uye inoburitswa zvakanaka.
Tora sampuli yemahara. Bata nesu izvozvi